发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition superior in size controllability, and to provide a resist pattern forming method. <P>SOLUTION: The positive resist composition includes (A) a resin component having an alkali solvable constitutional unit (a1) including a constitutional unit (a11) derived from (&alpha;-methyl)hydroxy styrene and a constitutional unit (a2) having an acid dissociative dissolution suppression group including an acid dissociative dissolution suppression group (II) expressed by the formula and/or a specific chain acid dissociative dissolution suppression group (III), (B) an acid forming agent for generating acid by exposure, and an aromatic amine. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006171439(A) 申请公布日期 2006.06.29
申请号 JP20040364567 申请日期 2004.12.16
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ANDO TOMOYUKI;HIROSAKI TAKAKO
分类号 G03F7/039;G03F1/68;G03F1/82;G03F7/004;G03F7/033;H01L21/027 主分类号 G03F7/039
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