| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus and a manufacturing method thereof where peeling off or cracking of a passivation film is prevented. <P>SOLUTION: A semiconductor chip 1 is formed to be nearly rectangular in a plane view, and has a groove 11 at the periphery part of its most surface. In order to coat the whole area of the surface of the semiconductor chip 1 except for the groove 11, the passivation film 2 is formed. On the passivation film 2, a stress relaxation layer 3, a re-wiring 4 and a sealing resin layer 5 are formed. The sealing resin layer 5 covers the whole of the surfaces of the passivation film 2, the stress relaxation layer 3, and the re-wiring 4, and makes a detour from the surfaces to a side face to fill the whole of the groove 11 at the semiconductor chip 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
