| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor sensor and its manufacturing method capable of preventing a defective semiconductor sensor chip lacking in characteristics from occurring. <P>SOLUTION: The semiconductor sensor 100 comprises a package member 10, an IC chip 30, a semiconductor sensor chip 50, and a lid 70, etc. The IC chip 30 is mounted on a chip mount on the bottom inside the package member 10 through the intermediary of an adhesive agent 20 formed of silicone resin, etc. The semiconductor sensor chip 50 is mounted on the IC chip 30 through the intermediary of an adhesive film 40. The package member 10 is electrically connected to the IC chip 30 with a wire 60a, and the IC chip 30 is electrically connected to the semiconductor sensor chip 50 with a wire 60b. An insulating film 90 is formed on the surfaces of the package member 10, the IC chip 30, the semiconductor sensor chip 50, and the wires 60a and 60b, and on the surface of the lid 70 confronting the inside of the package member 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
