| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-stage configuration semiconductor module wherein occurrence of a bent can be suppressed. <P>SOLUTION: The semiconductor module is formed by alternately laminating a resin board 3 mounted with a semiconductor chip 2, and a sheet member 5 formed with an opening 10 greater than the semiconductor chip 2 and adhered onto each resin board 3. The thickness of the resin board 4 located at the lowermost stage among the resin boards 3 is thicker than the thickness of the other resin boards 3. Further, each of first embedded conductors 7 formed to each of the first resin boards 3 is arranged to each of chip mounting regions, in a way that the conductors 7 form a plurality of symmetric rectangles from the inside of each region toward the outside thereof, and the arrangement interval of the first embedded conductors 7 becomes greater toward the outward rectangles. Each of second embedded conductors 9 formed to each of the sheet members 5 is arranged to each of the openings 10, in a way that the conductors 9 form a plurality of symmetric rectangles from the inside of each opening 10 toward the outside of each opening 10, and the arrangement interval of the second embedded conductors 9 becomes greater toward the outward rectangles. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
