| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing process of a solid state imaging device in which an image sensor can be mounted precisely on a substrate. <P>SOLUTION: In the manufacturing process of a solid state imaging device 1 including a substrate 2 mounting an image sensor 9 on one side and mounting an electronic component 30 on the opposite side, the image sensor 9 is mounted on the substrate 2 and then the electronic component 30 is mounted thus manufacturing a solid state imaging device. Since the image sensor 9 is mounted on the substrate 2 prior to the electronic component 30, a solid state imaging device where the image sensor 9 is mounted with high positional precision can be manufactured. The electronic component 30 is preferably connected with the substrate 2 by using conductive adhesive 31. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
