摘要 |
PROBLEM TO BE SOLVED: To provide a low thermal expansion linear body of which the constitution is simpler, and which is less expensive. SOLUTION: In the low thermal expansion linear body, a conductive linear body 1 of a positive coefficient of thermal expansion in which a groove 2 is formed in the length direction, and the linear body 3 which is inserted into the groove 2 and which has the lower positive coefficient of the thermal expansion than that of the conductive linear body of the positive coefficient of the thermal expansion or which has a negative coefficient of the thermal expansion are provided. Accordingly, the low thermal expansion linear body, which is simpler and more inexpensive, is provided. COPYRIGHT: (C)2006,JPO&NCIPI
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