发明名称 Processing a memory link with a set of at least two laser pulses
摘要 A set ( 50 ) of laser pulses ( 52 ) is employed to sever a conductive link ( 22 ) in a memory or other IC chip. The duration of the set ( 50 ) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse ( 52 ) within the set ( 50 ) is preferably within a range of about 0.1 ps to 30 ns. The set ( 50 ) can be treated as a single "pulse" by conventional laser positioning systems ( 62 ) to perform on-the-fly link removal without stopping whenever the laser system ( 60 ) fires a set ( 50 ) of laser pulses ( 52 ) at each link ( 22 ). Conventional IR wavelengths or their harmonics can be employed.
申请公布号 US2006140230(A1) 申请公布日期 2006.06.29
申请号 US20060359215 申请日期 2006.02.21
申请人 SUN YUNLONG;SWENSON EDWARD J;HARRIS RICHARD S 发明人 SUN YUNLONG;SWENSON EDWARD J.;HARRIS RICHARD S.
分类号 H01S3/10;B23K26/04;B23K26/06;B23K26/067;H01L21/768;H01L23/525;H01S3/00 主分类号 H01S3/10
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