| 摘要 |
An integrated heat management assembly that is thermally coupled to a component requiring temperature control is provided. The integrated heat management assembly in one embodiment of the invention is a heat switch which includes two opposed surfaces, a first surface being a hot contact which is coupled to the component, and the second surface being a cold contact which is coupled to a heat sink. An actuator which may be a phase changing material, is mechanically coupled to one of the two surfaces such that when the component reaches a threshold temperature, the actuator is triggered to bring the two surfaces into contact. In this manner, the hot surface conducts heat to the cold surface which then delivers heat to the heat sink to thereby lower the temperature of the component. Other embodiments include heat pipes associated with the heat switch in order to further dissipate heat or to divert it to other areas of the component requiring temperature control. Corresponding techniques are provided in accordance with the method of the invention.
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