发明名称 |
Method for controlling corrosion of a substrate |
摘要 |
A method for controlling corrosion of a substrate is provided herein. In one embodiment, a method for controlling corrosion of a substrate includes the steps of providing a substrate having a patterned photoresist layer with a metallic residue disposed thereon; exposing the substrate to a hydrogen-based plasma to remove the metallic residue; and removing the photoresist. The metallic residue may comprise residue from etching at least one of aluminum or copper. The metallic residue may further comprise a halogen compound from etching a metal-containing layer with a halogen-based process gas. The hydrogen-based plasma may comprise hydrogen (H<SUB>2</SUB>) and may further comprise at least one of nitrogen (N<SUB>2</SUB>) and water (H<SUB>2</SUB>O) vapor. The hydrogen-based plasma may further comprise an inert gas, such as argon (Ar).
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申请公布号 |
US2006137710(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20060363833 |
申请日期 |
2006.02.27 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
LIM EU J.;PONG CHUNGDEE;LEE CHANGHUN;KAWAGUCHI MARK;DING GUOWEN |
分类号 |
B08B6/00;H01L21/3065;B08B3/08;B08B7/00;C23F1/00;C25F1/00;H01L21/00;H01L21/02;H01L21/311;H01L21/321;H01L21/3213 |
主分类号 |
B08B6/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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