发明名称 |
Kombinierte Platten und Verfahren zu deren Herstellung |
摘要 |
Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10). <IMAGE> |
申请公布号 |
DE60301743(T2) |
申请公布日期 |
2006.06.29 |
申请号 |
DE2003601743T |
申请日期 |
2003.01.24 |
申请人 |
ARACO K.K., TOYOTA;DAIWA KASEI KOGYO K.K., OKAZAKI |
发明人 |
HETA, HITOSHI;NAGAYA, TAMOTSU;KONDO, TOSHIAKI;UCHIDA, MASAHIKO;SUZUKI, MAKOTO |
分类号 |
B29C45/14;B60R13/02;B29C65/60;B29C65/70;B29C70/84;B29L7/00;B29L31/58;F16B5/04 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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