| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor acceleration sensor for improving the shock resistance, and that can be miniaturized and made thin. <P>SOLUTION: The semiconductor acceleration sensor comprises a semiconductor acceleration sensor chip, and a case for storing the semiconductor acceleration sensor chip. The semiconductor acceleration sensor chip comprises a fixed section; a frame-like weight section, that has the lower surface height being nearly flush with that of the fixed section, has a prescribed gap with the fixed section, and surrounds the periphery of the fixed section; and a beam section, that connects the fixed section to the weight section and is smaller than the film thickness of the fixed section and the weight section. The case has a projection, where the fixed section of the semiconductor acceleration sensor chip is struck to the bottom surface section. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
