| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device that can efficiently takes out light from a face-up mounted semiconductor light emitting element. <P>SOLUTION: The light emitting device is provided with the semiconductor light emitting element 100 in which a p-layer and an n-layer are laminated upon another and a p-electrode electrically connected to the p-layer and an n-electrode electrically connected to the n-layer are formed on the same surface. The light emitting element 100 is mounted on a mounting member having circuits respectively electrically connected to the p- and n-electrodes with the electrodes on the upside. The p- and n-electrodes are connected to the circuits of the mounting member through conductive wires. The light emitting element 100 has a slope from the p-layer to the n-layer and the surface of the slope is constituted in a recessed and projecting structure. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
