| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing for producing, in a no-flow system, a semiconductor device in which a bumped semiconductor element is molded on a wiring circuit board in a face down structure. SOLUTION: The resin composition for semiconductor sealing comprises (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a compound having two or more phenolic hydroxy groups in one molecule, (C) a flux activating agent and (D) a curing accelerator represented by general formula (1) (wherein X<SB>1</SB>-X<SB>5</SB>are each hydrogen, a 1-9C alkyl group or fluorine) having particles in which maximum particle diameter is≤30μm and standard deviation of average particle diameter is≤5μm. COPYRIGHT: (C)2006,JPO&NCIPI |
