| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating heat transfer structure which dissipates heat by efficiently transferring heat generated by a heating element to a radiator so as to deliver stable performance for a long period even if the structure is thermally deformed by the action of temperature cycle or the like; and a substrate for a power module. SOLUTION: An insulating circuit board comprises an insulating ceramic 11, a circuit layer 12 which is made of Al and is provided on one face of the insulating ceramic 11, and a metal layer 13 which is made of Al and is provided on the other face of the insulating ceramic 11. An electrically conductive layer 14 which has at least one base material 15 with conductivity and at least one diamond particle layer 16 containing diamond particles 19 is provided on the top face of the circuit layer 12. Either the circuit layer 12 or the base material 15 positioned on one end, which is spaced apart from the circuit layer 12, of the electrically conductive layer 14 has a thickness of 0.8 mm or less. COPYRIGHT: (C)2006,JPO&NCIPI
|
