FORMATION METHOD OF RESIST PATTERN, MANUFACTURING METHOD OF CIRCUIT BOARD, AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a formation method of a resist pattern for fabricating a circuit board having landless or narrow-land-width through-holes that realize increase in density of a circuit board, a manufacturing method of a circuit board, and the circuit board. SOLUTION: A formation method of a resist pattern includes a step of forming a resin layer and a mask layer on a first plane of a board having through-holes, and a step of removing the resin layer on the through-holes and the peripheries of the through-holes in the first plane by supplying a liquid for removing the resin layer from a second plane of the substrate at a side opposite to the first plane. A circuit board is manufactured by using the formation method of the resist pattern. COPYRIGHT: (C)2006,JPO&NCIPI