| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film formation device for fixing formation conditions of an oxide film formed on the surface of an object treated by preventing oxidizing gas used for a thin film formation device from being spent on the oxidization of the internal wall of a vacuum treatment chamber or the surface of a component. SOLUTION: In this thin film formation device for introducing oxidizing gas to the inside of a treatment chamber 1, and for forming an oxide film on an object 4 to be treated, component surfaces 1, 2 and 3 with which the oxidizing gas is brought into contact are coated with a fine oxide film whose thickness is 1μm or less. COPYRIGHT: (C)2006,JPO&NCIPI
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