发明名称 METHOD AND DEVICE FOR MEASURING TEMPERATURE, AND SEMICONDUCTOR HEAT TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method and device for measuring temperature capable of measuring a temperature highly accurately in the noncontact state without requiring a complicated hardware constitution, and a semiconductor heat treating device using the temperature measuring method. SOLUTION: In order to measure the temperature of a semiconductor wafer 3 in the noncontact state, radiated light from the semiconductor wafer 3 is measured, and the temperature of a semiconductor wafer 3 is operated, while estimating an effective radiation rate as an unknown variable, based on a measurement result of the radiated light. Estimation of the effective radiation rate and operation of the temperature are performed by using an extended Kalman filter. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006170616(A) 申请公布日期 2006.06.29
申请号 JP20010062600 申请日期 2001.03.06
申请人 TOKYO ELECTRON LTD 发明人 SUZUKI TOMOHIRO
分类号 G01J5/00;G01J5/02;H01L21/66 主分类号 G01J5/00
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