| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for machining a substrate capable of reducing the damage of a cut surface when an object to be machined having a cutting starting point formed in the two directions is cut, and to provide a device for extending a film. SOLUTION: The device 1 for extending the film has a table 2 with a placing surface 20a for placing a wafer 50 stuck with the extensible film 40, a pair of first holders 11 being arranged on both sides of the table 2 in the X-axial direction respectively and holding the extensible film 40, and a pair of second holders 12 being arranged on both sides of the table 2 in the Y-axial direction and holding the extensible film 40. The device for extending the film further has a cylinder 22 extending the extensible film 40 in the X-axial direction by expanding distances among the placing surface 20a of the table 2 and the first holders 11, and the cylinder 21 extending the extensible film 40 in the Y-axial direction by expanding the distances among the placing surface 20a of the table 2 and the second holders 12. COPYRIGHT: (C)2006,JPO&NCIPI |
