| 摘要 |
PROBLEM TO BE SOLVED: To position a semiconductor wafer without using a positioning-only alignment mark. SOLUTION: The semiconductor wafer 2 has an X-axis direction scanning region A where only one wiring pattern 10 having a width which is not larger than a positioning laser diameter, within a range where a positioning laser beam is scanned in an X-axis direction is formed in a Y-axis direction, and a Y-axis direction scanning region B where only one wiring pattern 10 having the width which is not larger than the positioning laser diameter, within a range where the positioning laser beam is scanned in the Y-axis direction is formed in the X-axis direction are installed near a pad opening 8 in a chip region 4. COPYRIGHT: (C)2006,JPO&NCIPI |
