| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method of a mask for solder paste printing which enables efficient cleaning and removal of a residual solder paste after a solder paste is printed by using the mask for solder paste printing, and a solder paste printing machine. SOLUTION: The mask for printing to which the solder paste after the solder paste printing sticks is cleaned by a cleaning mechanism which is provided for the solder paste printing machine and so constituted that it automatically cleans the mask for printing after the printing without detaching it from the printing machine. On the occasion, the mask is subjected to wet type cleaning with a cleaning solution containing an alcoholic solvent and an ethylene glycol solvent, while at least either blowing or sucking is executed for the mask to which the cleaning solution after the cleaning sticks. The rate of the ethylene glycol solvent in the cleaning solution is made to be 10-90 volume%. COPYRIGHT: (C)2006,JPO&NCIPI
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