发明名称 |
Light emitting diode package and process of making the same |
摘要 |
A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.
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申请公布号 |
US2006138436(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20050147185 |
申请日期 |
2005.06.08 |
申请人 |
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发明人 |
CHEN MING-HUNG;WEN SHIH-YI;KUO WU-CHENG;CHEN BING-RU;WENG JUI-PING;LEE HSIAO-WEN |
分类号 |
H01L33/54;H01L21/00;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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