| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of vacuum-laminating a film-like adhesive on an inner-layer circuit pattern, maintaining an extremely superior surface smoothness, in a method of manufacturing a multilayer printed wiring board, using a build-up process in which a conductor circuit layer and an insulating layer are stacked alternately. <P>SOLUTION: In the method of the vacuum-lamination, an adhesive film composed of a support base film and a resin compound layer, which is solid at room temperature, has thermal fluidity, and is stacked on the surface of the support base layer, is vacuum-laminated on a patterned circuit substrate under heating and pressing conditions. The method for the vacuum-lamination of the adhesive film comprises (1) a step of heating and pressing the adhesive film to vacuum-laminate the adhesive film on the circuit board 3, while a heat-resistant rubber is placed on the support base film side, and (2) a step of interposing a protective film 2 larger than the adhesive film, between the adhesive film and a metal plate 1 for pressing and/or a metal roll for lamination, and heating the adhesive film from the support base film side and pressing the adhesive film to smooth the adhesive film. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
