| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multi-chip module and its manufacturing method by which wiring structures among a plurality of devices can be constituted easily and bonding work can be simplified. <P>SOLUTION: The multi-chip module is constituted by bonding first to fourth substrates 1-4 on which chip-like devices (laminated DRAM sections A, fine passive element sections B, DSP sections C, and sensor MEMS sections D) are respectively mounted in a laminated state. These substrates 1-4 are provided with through wiring 5 formed through the substrates 1-4 so that one ends of the through wiring 5 may be connected to the devices or the wiring of other layers and, at the same time, inserting holes 7 formed correspondingly to the mounting areas of the devices mounted on all lower-layer substrates. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
