| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a circuit board sheet so that position shifts of respective circuit board sheet layers forming the multilayer circuit board can be made as small as possible. SOLUTION: Disclosed is the manufacturing method for the multilayer circuit board in which a pair of circuit board sheets 11 and 12 constituting the multilayer circuit board are prepared and each have at least one circuit board element arranged on a substrate material having a conductive layer on at least one surface of an insulating layer, and those circuit board sheets are stacked to form the multilayer circuit board, the manufacturing method for the multilayer circuit board being characterized in that a pair of circuit board sheets for constituting an identical multilayer circuit board are formed on one long substrate material 100 and cut into circuit board sheets and the multilayer circuit board is formed by stacking those circuit board sheets. COPYRIGHT: (C)2006,JPO&NCIPI |
