| 摘要 |
PROBLEM TO BE SOLVED: To securely fix an electronic part even when an applying quantity of an adhesive is small. SOLUTION: The device is provided with a printed circuit board 2 and an electronic component 3 having a pair of lead parts 35. Lands for soldering the respective lead parts 35 to the printed circuit board 2 are formed. Between the lands on the printed circuit board 2, a silk printing layer 1 is formed. The adhesive 4 is applied on the silk printing layer 1 to fix the electronic component 3 with the adhesive 4. COPYRIGHT: (C)2006,JPO&NCIPI
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