| 摘要 |
PROBLEM TO BE SOLVED: To reduce troubles caused by cracks and peeling of a sealing part which seals the inner lead of an electric wiring board (TAB). SOLUTION: A head board H1100 being an element chip is positioned to the device hall H1302 of the electric wiring board H1300, and both the head board and the electric wiring board are fixed to a base board H1200 via a support board H1400. The inner lead H1303 of the electric wiring board H1300 is connected to the electric connection part of the head board H1100, a chip circumference sealing material 19 is filled around the head board H1100, to seal the inner lead H1303 with an ILB sealing material 20 from the surface side of the electric wiring board H1300. So as to prevent the ILB sealing material 20 from flowing on the chip circumference sealing material 19, recessed portions 22 to catch the ILB sealing material 20 is provided on the surface of the electric wiring board H1300. COPYRIGHT: (C)2006,JPO&NCIPI
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