| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity by reducing a heat treatment time by cooling a semiconductor wafer in the carries of a heat treatment apparatus for a semiconductor wafer. SOLUTION: The apparatus has a direct acting type semiconductor wafer carrier. The semiconductor wafer carrier has a carrying arm 2C for mounting a semiconductor wafer, and a piping part 3S having a hollow portion which is the passage of a medium used for cooling the semiconductor wafer. In the heat treatment apparatus, the connecting configuration between an exhaust piping part in the semiconductor wafer carrier and the separation/junction part of an external piping to be inserted to a cabinet is a shield method using an O ring. A medium delivered through the piping part of a wafer carrier is discharged or supplied from an opening provided on the semiconductor wafer mount surface of a carrying arm for mounting the semiconductor wafer. COPYRIGHT: (C)2006,JPO&NCIPI
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