| 摘要 |
Disclosed is a wafer electroplating apparatus, which includes an electroplating bath comprising an anode in the electroplating bath, an electroplating solution, and a cathode located on the top of the electroplating bath and on to which a wafer is mounted. The cathode comprises a first portion electrically connected to an edge of the wafer, and a second portion extending from the first portion and electrically connected to a side of the wafer. The direct contact of the cathode with the side and front edges of the wafer ensures uniform distribution of the electrical field on the wafer during the electroplating process. Consequently, a uniform thickness of metal film deposition is achieved.
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