ELECTRONIC PACKAGE HAVING DOWN-SET LEADS AND METHOD
摘要
<p>In one embodiment, a leadless package includes down-set conductive leads having base portions. The base portions include stand-offs that attach to electrodes on an electronic chip using, for example, a solder die attach material. An optional encapsulating layer covers portions of the down-set conductive leads and portions of the electronic chip while leaving pad portions of the down-set conductive leads and a surface of the electronic chip exposed. The pad portions and the surface of the electronic chip are oriented to attach to a next level of assembly.</p>
申请公布号
WO2006068641(A1)
申请公布日期
2006.06.29
申请号
WO2004US43075
申请日期
2004.12.20
申请人
SEMICONDUCTOR COMPONENTS INDUSTRIES, L.L.C.;LETTERMAN, JAMES P., JR.;FAUTY, JOSEPH K.;YODER, JAY A.;BURGHOUT, WILLIAM F.
发明人
LETTERMAN, JAMES P., JR.;FAUTY, JOSEPH K.;YODER, JAY A.;BURGHOUT, WILLIAM F.