| 摘要 |
According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a laptop computer. The arrangement includes a heat spreader having a first section including at least one thermally conductive coupling member to thermally engage surfaces of electronic components on the heat-generating device and a second section including at least one spring member to cause pressurized engagement between the first section and the surfaces of the electronic components. The heat spreader may further be thermally coupled to a heat exchanger or a keyboard from which the heat is dissipated. Other embodiments are also described and claimed.
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