发明名称 |
Kupfer-Nickel-Silizium Zweiphasen-Abschrecksubstrat |
摘要 |
A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates. |
申请公布号 |
DE112004001542(T5) |
申请公布日期 |
2006.06.29 |
申请号 |
DE20041101542 |
申请日期 |
2004.08.13 |
申请人 |
METGLAS, INC. |
发明人 |
MYOJIN, SHINYA;BYE, RICHARD L.;DECRISTOFARO, NICHOLAS J.;MILLURE, DAVID W.;SCHUSTER, GARY B. A. |
分类号 |
B22D11/06;B21J1/04;B21J5/00;B22D21/00;C22C;C22C9/06;C22F1/00;C22F1/08 |
主分类号 |
B22D11/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|