| 摘要 |
PROBLEM TO BE SOLVED: To provide a rigid-flex multilayer printed wiring board which can prevent a shield member formed on the outer surface of an inner-layer substrate from being transferred onto an outer-layer substrate and delaminated from the inner-layer substrate at the time of removing the outer-layer substrate to form a flexible portion, and also to provide its manufacturing method. SOLUTION: The rigid-flex multilayer printed wiring board consists of a rigid portion having a rigidity and the flexible portion having a flexibility, with the rigid portion having a multilayer structure. On a region of an inner-layer FPC 30 shared by the rigid portion and the flexible portion which serves for the flexible portion, the shield member 40A (40B) and a protection member 70A (70B) formed of a material different from that of the shield member are stacked in order. COPYRIGHT: (C)2006,JPO&NCIPI |
