| 摘要 |
PROBLEM TO BE SOLVED: To provide a rigid-flex multilayer printed wiring board which can prevent a shield member formed on the outer surface of an inner-layer substrate from being transferred onto an outer-layer substrate and delaminated from the inner-layer substrate at the time of removing the outer-layer substrate to form a flexible portion, and also to provide its manufacturing method. SOLUTION: The rigid-flex multilayer printed wiring board consists of a rigid portion having a rigidity and the flexible portion having a flexibility. On a region of an inner-layer FPC 30 shared by the rigid portion and the flexible portion which serves for the flexible portion, the shield member 40A (40B) are arranged. An outer-layer RPC consists of a regionαsurrounded by a slit and the other regionβ. The regionαwhich faces the shield member when stacking the outer-layer RPC on the inner-layer FPC is retreated inside to form a hollow portion in the outer-layer RPC. The outer-layer RPC is formed on the inner-layer FPC in such a manner that the regionαretreated inside may overlap the shield member while the regionβmay not overlap the shield member. COPYRIGHT: (C)2006,JPO&NCIPI |
