| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer molding which is excellent in the bonding strength between the layers without use of an added material such as an adhesive and which does not cause interlayer delamination. SOLUTION: In the multilayer molding at least comprising a first resin layer mainly composed of a first polymer material and a second resin layer mainly composed of a second polymer material, the first polymer material has a higher melt viscosity at a predetermined temperature compared with the second polymer material and in the interlayer between the first resin layer and the second resin layer there is formed entanglement of the polymer chain composing the first resin layer and the polymer chain composing the second resin layer. COPYRIGHT: (C)2006,JPO&NCIPI |
