| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering iron capable of performing the soldering while the soldering iron is held by one hand, and a component is positioned at the mounting position by another hand. SOLUTION: A groove 5 is formed in an iron tip 4 of a soldering iron, and molten solder 6 is stored in the groove 5 of the iron tip 4. For example, when a leg 9 of an IC part of the surface mounting type is soldered, the soldering iron 1 is held by one hand, the IC part 8 is positioned by another hand, and the soldering is performed with the molten solder 6 stored in the groove 5 of the iron tip 4. COPYRIGHT: (C)2006,JPO&NCIPI |
