| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a plating layer of the inner periphery of a through-hole from being scraped, when the plating layer of the inner periphery of the through-hole and a terminal fittings inserted into the through-hole are kept in a connected state, without relying on soldering. <P>SOLUTION: A substrate connecting part 24 can be inserted against the through-hole 31 of the circuit board 30, without being contacted with the plating layer 32. Accordingly, there is no possibility that the plating layer 32 is scraped by the terminal fittings 20. When the external load is given to a receiving part 27, after insertion of the substrate connecting part 24, it is kept in a state of contacting the plating layer 32, because the substrate connecting part 24 is enlarged in size and deformed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
