| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallic paste which can be formed into a thin film while maintaining conductivity and adhesion strength with a substrate, capable of forming a dense and flat thin film, and that, a fine pattern, as well as a conductive film on which the metallic paste is baked. SOLUTION: The metallic paste contains at least fine metal powder, colloidal silicic acid, and metal compound, and forms the conductive film while vitrifying, by the reaction of colloidal silicic acid and metal compound during baking process. COPYRIGHT: (C)2006,JPO&NCIPI
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