| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system capable of improving the utilizing efficiency of a target material without causing the intrusion of impurities into a film in sputtering. SOLUTION: Targets are arranged so as to surround a space at which plasma is generated during discharge, and at least the part located between a substrate and the plasma is provided with openings. In this way, the phenomenon that members other than the target material are sputtered is prevented, and the utilizing efficiency of the target material can be improved without causing the intrusion of impurities into a film. COPYRIGHT: (C)2006,JPO&NCIPI
|
