| 摘要 |
A method for aligning a substrate in a lithographic apparatus is presented. The substrate includes a plurality of alignment marks. The alignment marks have been defined by a second lithographic apparatus and are arranged to provide a substrate grid as a coordinate system that includes a first and a second direction, substantially perpendicular to the first direction. The method includes measuring a location and an orientation of the alignment marks to obtain alignment mark data; determining the substrate grid of the substrate from the alignment mark data by using a first substrate grid model with a first set of parameters; determining the substrate grid of the substrate from the alignment mark data by using a second substrate grid model with a second set of parameters, the second set of parameters including an ortho-scaling parameter in addition to the first set of parameters, and correcting machine-to-machine differences between the lithographic apparatus and the second lithographic apparatus with automated process control data based on the ortho-scaling parameter.
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