| 发明名称 |
Method for wafer stacking using copper structures of substantially uniform height |
| 摘要 |
A method for wafer stacking employing substantially uniform copper structures is described herein.
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| 申请公布号 |
US2006138618(A1) |
申请公布日期 |
2006.06.29 |
| 申请号 |
US20060359002 |
申请日期 |
2006.02.21 |
| 申请人 |
RAMACHANDRARAO VIJAYAKUMAR S;RAMANATHAN SHRIRAM |
发明人 |
RAMACHANDRARAO VIJAYAKUMAR S.;RAMANATHAN SHRIRAM |
| 分类号 |
H01L23/495;H01L21/30;H01L21/768;H01L21/98;H01L25/065 |
主分类号 |
H01L23/495 |
| 代理机构 |
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