发明名称 Refrigeration system, compressing and heat-releasing apparatus and heat-releasing device
摘要 A refrigeration system including a two-stage type compressor having independent low-pressure and high-pressure compressing portions, a heat-releasing device having independent primary and secondary heat-releasing paths, an expansion valve and a cooler. The refrigerant primarily compressed by the low-pressure compressing portion is primarily released in heat by the primary heat-releasing path. The primarily heat-released refrigerant is secondarily compressed by the high-pressure compressing portion. The secondarily compressed refrigerant is secondarily released in heat by the secondary heat-releasing path to thereby obtain a low-temperature and high-pressure refrigerant. The low-temperature and high-pressure refrigerant is decompressed and expanded by an expansion valve and passes through the cooler to absorb the heat in a room air, and then returns to the low-pressure compressing portion of the compressor. In this system, the refrigerant temperature during the heat-releasing procedure can be kept low.
申请公布号 US2006137385(A1) 申请公布日期 2006.06.29
申请号 US20050531705 申请日期 2005.09.29
申请人 SHOWA DENKO K.K. 发明人 TAKE KOICHIRO;SHINMURA ETSUO;FURUKAWA YUICHI
分类号 F25B1/00;F25B1/10;F25B9/00;F25B39/04;F25B40/00;F25B41/00;F28D1/04;F28D1/053 主分类号 F25B1/00
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