发明名称 |
Refrigeration system, compressing and heat-releasing apparatus and heat-releasing device |
摘要 |
A refrigeration system including a two-stage type compressor having independent low-pressure and high-pressure compressing portions, a heat-releasing device having independent primary and secondary heat-releasing paths, an expansion valve and a cooler. The refrigerant primarily compressed by the low-pressure compressing portion is primarily released in heat by the primary heat-releasing path. The primarily heat-released refrigerant is secondarily compressed by the high-pressure compressing portion. The secondarily compressed refrigerant is secondarily released in heat by the secondary heat-releasing path to thereby obtain a low-temperature and high-pressure refrigerant. The low-temperature and high-pressure refrigerant is decompressed and expanded by an expansion valve and passes through the cooler to absorb the heat in a room air, and then returns to the low-pressure compressing portion of the compressor. In this system, the refrigerant temperature during the heat-releasing procedure can be kept low.
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申请公布号 |
US2006137385(A1) |
申请公布日期 |
2006.06.29 |
申请号 |
US20050531705 |
申请日期 |
2005.09.29 |
申请人 |
SHOWA DENKO K.K. |
发明人 |
TAKE KOICHIRO;SHINMURA ETSUO;FURUKAWA YUICHI |
分类号 |
F25B1/00;F25B1/10;F25B9/00;F25B39/04;F25B40/00;F25B41/00;F28D1/04;F28D1/053 |
主分类号 |
F25B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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