Method of producing a complex structure by assembling stressed structures

摘要

The invention relates to a method of producing a complex microelectronic structure, in which two basic microelectronic structures ( 1, 3 ) are assembled at the two respective connecting faces ( 3 ) thereof. The invention is characterised in that, before assembly, a difference is created in the tangential stress state between the two faces to be assembled, said difference being selected such as to produce a pre-determined stress state within the assembled structure under given conditions in relation to the assembly conditions.