Multichip integrated circuit assembly with interconnection structure,申请号US19640417091-传众专利搜索

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发明名称	Multichip integrated circuit assembly with interconnection structure
摘要
申请公布号	US3388301(A)	申请公布日期	1968.06.11
申请号	US19640417091	申请日期	1964.12.09
申请人	SIGNETICS CORPORATION	发明人	JAMES BRIAN DAVID
分类号	H01L21/60;H01L21/74;H01L23/04;H01L23/24;H05K3/22	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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