摘要 |
<p>A method and apparatus for cleaning a processing chamber comprising blocking a flow of cooling fluid to a channel within a support member within a processing chamber, elevating the support member to be within about 0.1 inches of a gas distribution plate, heating the gas distribution plate, and introducing a thermally conductive gas through the gas distribution plate into the processing chamber. In one aspect, the chamber comprises a chamber body and a support assembly at least partially disposed within the chamber body adapted to support a substrate thereon. The chamber further comprises a lid assembly disposed on an upper surface of the chamber body. The lid assembly includes a top plate and a gas delivery assembly which define a plasma cavity therebetween, wherein the gas delivery assembly is adapted to heat the substrate. A remote plasma source having a U-shaped plasma region is connected to the gas delivery assembly.</p> |
申请人 |
APPLIED MATERIALS, INC.;KAO, CHIEN-TEH;CHOU, JING-PEI (CONNIE);UMOTOY, SALVADOR P.;CHANG, MEI;YUAN, XIAOXIONG (JOHN);CHANG, YU;LU, XINLIANG;PHAN, SEE-ENG;KUANG, WILLIAM;TZU, GWO-CHUAN;OR, DAVID T. |
发明人 |
KAO, CHIEN-TEH;CHOU, JING-PEI (CONNIE);UMOTOY, SALVADOR P.;CHANG, MEI;YUAN, XIAOXIONG (JOHN);CHANG, YU;LU, XINLIANG;PHAN, SEE-ENG;KUANG, WILLIAM;TZU, GWO-CHUAN;OR, DAVID T. |