| 摘要 |
An apparatus and a method for electrochemical plating form a metallic layer on a substrate having a seed layer. The apparatus includes an electrochemical cell containing an electrolyte solution; a plurality of bodies arranged in the electrochemical solution to form an anode; a substrate having a seed layer thereon, the substrate disposed in the electrochemical cell opposite the anode, such that the anode and the seed layer are separated by an ion travel distance; and a distance controller for independently driving at least one of the plurality of bodies to control the ion travel distance, thereby enabling uniformity control of the metallic layer formed on the substrate by independently adjusting distances between the substrate and respective bodies constituting the anode. The method is applicable to the formation of a metallic layer on a large-scale wafer, so that uniformity of an electrochemical metal layer for semiconductor devices having a small feature size can be advantageously controlled. |
