发明名称 Semiconductor package assembly and method for electrically isolating modules
摘要 A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
申请公布号 GB2385984(B) 申请公布日期 2006.06.28
申请号 GB20010026821 申请日期 2001.11.07
申请人 MICRON TECHNOLOGY INC 发明人 TIMOTHY BALES;SION C QUINLAN
分类号 H01L23/64 主分类号 H01L23/64
代理机构 代理人
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