发明名称 Manufacturing method of an integrated package for a radiation sensing device
摘要 <p>A radiation detector ( 10 ) has a base ( 30 ), a frame ( 48 ), a window ( 46 ), and solder layers ( 50, 52 ) formed from a solder pre-form ( 58, 60 ) to define a vacuum chamber ( 56 ). Feedthroughs ( 18, 40, 44 ) penetrate the base ( 30 ) for electrical connection to internal components. A method for sealing the detector ( 10 ) aligns a lower detector assembly ( 62 ), the frame ( 48 ) the window ( 46 ), and the solder pre-forms ( 58, 60 ) in a non-sealed relation within a processing chamber ( 80, 94 ). High temperature and low pressure is imposed, and the getter ( 42 ) is activated by resistive heating imposed by current leads ( 88 ). The window ( 46 ), frame ( 48 ), and lower detector assembly ( 62 ) are then pressed together and sealed by the liquefied solder pre-forms ( 58, 60 ). The method eliminates the need for a seal port, combines several steps within the processing chamber ( 80, 94 ), and eliminates certain prior art cleaning steps.</p>
申请公布号 EP1673814(A2) 申请公布日期 2006.06.28
申请号 EP20040795461 申请日期 2004.10.16
申请人 RAYTHEON COMPANY 发明人 KENNEDY, ADAM M.;BAILEY, MICHAEL C.;MEISSNER, EDWARD;DODDS, ROBERT K.;VANLUE, DAVID
分类号 G01J5/04;G01J5/08;H01L23/055;H01L27/146;H01L31/0203;(IPC1-7):H01L31/020 主分类号 G01J5/04
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