发明名称 |
Circuit board, process for producing the same and a power module employing the same |
摘要 |
Composite member 2 consisting of ceramic insulator substrate 3 and two metal layers 4A and 4B such as aluminum sheets is subjected to milling in order to remove the unwanted areas of metal layer 4A (where inter-element spacings are to be formed). In order to suppress cracking due to substrate warpage, a small bottom portion of 4A is left intact as residual metal layer 4Aa which is preferably removed by etching. Milling is performed after thin-film layer of etching resist 5 is applied to the surface of metal layer 4A. By milling in two stages, a step is formed at the bottom of lateral sides of a pattern element to make a skirt which contributes to reducing external stresses. |
申请公布号 |
EP1463388(A3) |
申请公布日期 |
2006.06.28 |
申请号 |
EP20040001846 |
申请日期 |
2004.01.28 |
申请人 |
DOWA MINING CO., LTD. |
发明人 |
HARA, MASAHIRO;OSANAI, HIDEYO |
分类号 |
B23C3/00;H05K3/04;H01L23/12;H05K1/02;H05K1/03;H05K3/06 |
主分类号 |
B23C3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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