发明名称 Enclosure with pre-formed interchangeable panels
摘要 An enclosure for an electronic device has a front opening and rear opening formed by a base casing and a U-shaped cover mounted together thereon. A plurality of modular plates with electrical components pre-mounted thereon are removably and interchangeably mounted at selected positions in the front opening and rear opening of the base casing. The modular plates have an extension bottom leg portion having a shape and configuration with a complementary to those of mounting openings formed in even spacings along the entire length of the edge portion of the base casing. The modular plates also have an upper extension lip engageable with elongated channels formed on an underside edge portion of the front edge and rear edge of the cover.
申请公布号 US7068516(B2) 申请公布日期 2006.06.27
申请号 US20040771095 申请日期 2004.02.06
申请人 CHAN ERIC K D;CHU KING SUM 发明人 CHAN ERIC K. D.;CHU KING SUM
分类号 H05K5/00;H02B1/00;H05K5/04 主分类号 H05K5/00
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