发明名称 |
Temperature-homogenizing device |
摘要 |
A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.
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申请公布号 |
US7066244(B2) |
申请公布日期 |
2006.06.27 |
申请号 |
US20040756064 |
申请日期 |
2004.01.13 |
申请人 |
DELTA ELECTRONICS, INC. |
发明人 |
CHEN YIN-YUAN;WU WEN-CHING;HSU JUI-YUAN |
分类号 |
F28F7/00;H01L23/36;H01L23/433;H05K7/20 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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